JPH0226387B2 - - Google Patents

Info

Publication number
JPH0226387B2
JPH0226387B2 JP58020048A JP2004883A JPH0226387B2 JP H0226387 B2 JPH0226387 B2 JP H0226387B2 JP 58020048 A JP58020048 A JP 58020048A JP 2004883 A JP2004883 A JP 2004883A JP H0226387 B2 JPH0226387 B2 JP H0226387B2
Authority
JP
Japan
Prior art keywords
socket
semiconductor device
testing
tested
package structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58020048A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59145546A (ja
Inventor
Katsuhiko Tsura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP58020048A priority Critical patent/JPS59145546A/ja
Publication of JPS59145546A publication Critical patent/JPS59145546A/ja
Publication of JPH0226387B2 publication Critical patent/JPH0226387B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP58020048A 1983-02-09 1983-02-09 半導体装置の検査装置 Granted JPS59145546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58020048A JPS59145546A (ja) 1983-02-09 1983-02-09 半導体装置の検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58020048A JPS59145546A (ja) 1983-02-09 1983-02-09 半導体装置の検査装置

Publications (2)

Publication Number Publication Date
JPS59145546A JPS59145546A (ja) 1984-08-21
JPH0226387B2 true JPH0226387B2 (en]) 1990-06-08

Family

ID=12016172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58020048A Granted JPS59145546A (ja) 1983-02-09 1983-02-09 半導体装置の検査装置

Country Status (1)

Country Link
JP (1) JPS59145546A (en])

Also Published As

Publication number Publication date
JPS59145546A (ja) 1984-08-21

Similar Documents

Publication Publication Date Title
CN109557376B (zh) 电阻测定装置、基板检查装置以及电阻测定方法
JPH07191080A (ja) 電気接続の完全性を測定するための装置と方法
CN101231322A (zh) 集成电路开路/短路的测试连接方法及装置
US5825171A (en) Universal burn-in board
JP2018163087A (ja) 半導体装置の製造方法および半導体装置の検査装置ならびに半導体装置
JP3730340B2 (ja) 半導体試験装置
JPH0226387B2 (en])
US12094789B2 (en) Analog sense points for measuring circuit die
JPH0348171A (ja) 混成集積回路板の電気的特性検査を行う方法
JPH1138079A (ja) ボールグリッドアレイ型集積回路の試験方法
JPH01129432A (ja) 集積回路
JPS626653B2 (en])
KR0179093B1 (ko) 테스트 어댑터 보드 체크기
JP2591453B2 (ja) バーンインボード検査装置およびバーンインボード検査方法
JPH0347581B2 (en])
JPH0517667Y2 (en])
JP3436183B2 (ja) 半導体検査装置およびそれを用いた検査方法
JPS63211642A (ja) 半導体試験装置
JP2017009468A (ja) 半導体装置の製造方法
JPS60113165A (ja) 半導体素子のバ−ンイン装置
JPH06130108A (ja) プリント基板の試験方法
JPH07287042A (ja) インサーキット検査方法
JPS61104271A (ja) 回路チエツクアツプツ−ル
JPH04302453A (ja) 半導体試験装置
JPH03200075A (ja) 導通状態試験装置